? semiconductor components industries, llc, 2006 february, 2006 ? rev. 5 1 publication order number: mmbv109lt1/d mmbv109lt1, mv209 preferred devices silicon epicap diodes designed for general frequency control and tuning applications; providing solid?state reliability in replacement of mechanical tuning methods. features ? high q with guaranteed minimum values at vhf frequencies ? controlled and uniform tuning ratio ? available in surface mount package ? pb?free packages are available maximum ratings (t c = 25 c unless otherwise noted) rating symbol value unit reverse voltage v r 30 vdc forward current i f 200 madc forward power dissipation mmbv109lt1 @ t a = 25 c derate above 25 c mv209 @ t a = 25 c derate above 25 c p d 200 2.0 200 1.6 mw mw/ c mw mw/ c junction temperature t j +125 c storage temperature range t stg ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 adc) v (br)r 30 ? ? vdc reverse voltage leakage current (v r = 25 vdc) i r ? ? 0.1 adc diode capacitance temperature co- efficient (v r = 3.0 vdc, f = 1.0 mhz) tc c ? 300 ? ppm/ c http://onsemi.com 26?32 pf voltage variable capacitance diodes 3 cathode 1 anode 2 cathode 1 anode sot?23 to?92 preferred devices are recommended choices for future use and best overall value. 1 2 3 1 2 mv 209 ayww to?92 (to?226ac) case 182 style 1 sot?23 (to?236) case 318?08 style 8 mv209 = device code a = assembly location y = year ww = work week = pb?free package see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information 1 m4a m m4a = device code m = date code* = pb?free package (note: microdot may be in either location) (note: microdot may be in either location) *date code orientation and/or overbar may vary depending upon manufacturing location. marking diagrams
mmbv109lt1, mv209 http://onsemi.com 2 c t , diode capacitance v r = 3.0 vdc, f = 1.0 mhz pf q, figure of merit v r = 3.0 vdc f = 50 mhz c r , capacitance ratio c 3 /c 25 f = 1.0 mhz (note 1) device package shipping ? min nom max min min max mmbv109lt1 sot?23 3,000 / tape & reel 26 29 32 200 5.0 6.5 mmbv109lt1g sot?23 (pb?free) 3,000 / tape & reel mmbv109lt3 sot?23 10,000 / tape & reel mmbv109lt3g sot?23 (pb?free) 10,000 / tape & reel mv209 to?92 1,000 units / bag MV209G to?92 (pb?free) 1,000 units / bag 1. c r is the ratio of c t measured at 3 vdc divided by c t measured at 25 vdc. figure 1. diode capacitance 40 32 24 16 8 0 1 3 10 30 100 v r , reverse voltage (volts) c t , capacitance ? pf figure 2. figure of merit f, frequency (mhz) figure 3. leakage current t a , ambient temperature figure 4. diode capacitance t a , ambient temperature q, figure of merit 10 1000 100 10 100 1000 , reverse current (na) 100 ?60 0.01 0.001 0 +40 +100 c t , diode capacitance (normalized) 1.04 ?75 1.02 1.00 0.98 0.96 ?25 +25 +75 +125 v r = 3.0 vdc f = 1.0 mhz c t c c + c j 36 28 20 12 4 f = 1.0 mhz t a = 25 c v r = 3 vdc t a = 25 c v r = 20 vdc +120 +140 +80 +60 +20 ?40 ?20 i r 0.1 1.0 10 20 2.0 0.2 0.02 0.002 0.006 0.06 0.6 6.0 60 ?50 0 +50 +100 1.03 1.01 0.99 0.97 notes on testing and specifications
mmbv109lt1, mv209 http://onsemi.com 3 package dimensions style 8: pin 1. anode 2. no connection 3. cathode sot?23 (to?236) case 318?08 issue an d a1 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318?01 thru ?07 and ?09 obsolete, new standard 318?08. mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 view c l 0.25 l1 e e e b a see view c dim a min nom max min millimeters 0.89 1.00 1.11 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 d 2.80 2.90 3.04 0.110 e 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 l 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 nom max l1 h 2.10 2.40 2.64 0.083 0.094 0.104 h e 0.35 0.54 0.69 0.014 0.021 0.029 c *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
mmbv109lt1, mv209 http://onsemi.com 4 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond zone r is uncontrolled. 4. lead dimension is uncontrolled in p and beyond dimension k minimum. a l k b r p d h g xx seating plane 12 v n c n section x?x d j dim min max min max millimeters inches a 0.175 0.205 4.45 5.21 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.021 0.407 0.533 g 0.050 bsc 1.27 bsc h 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.500 ??? 12.70 ??? l 0.250 ??? 6.35 ??? n 0.080 0.105 2.03 2.66 p ??? 0.050 ??? 1.27 r 0.115 ??? 2.93 ??? v 0.135 ??? 3.43 ??? style 1: pin 1. anode 2. cathode to?92 (to?226ac) case 182?06 issue l on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 mmbv109lt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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